| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a plated through hole capable of satisfactorily forming a plated layer and hardly generating a problem caused by the entering and remaining of plating liquid when a porous film is used for an insulating layer of a wiring board, and to provide the wiring board having the plated through hole formed by the method. <P>SOLUTION: The method for forming the plated through hole comprises steps of forming a through hole H1 by drilling a laminated sheet SP having a resin porous layer 12 of not less than one layer, and forming a plated layer on at least the inside periphery of the through hole H1. The resin porous layer 12 forms a densified dense layer 12a on the inside periphery of the through hole H1 by the drilling. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
