| 发明名称 |
SEMICONDUCTOR SEALING MATERIAL FOR W-BGA AND W-BGA SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing molding material suitable for manufacturing a W (window-side devised)-BGA semiconductor device simultaneously satisfying low warpage property, high filler loading property and low thin-burr-generating property. <P>SOLUTION: The semiconductor sealing material for W-BGA comprises as essential ingredients an epoxy resin, a curing material, an auxiliary curing agent and an inorganic filler. The content of the inorganic filler is 75-92 mass% of the whole sealing material. Tetraphenylphosphonium tetraphenylborate and triphenylphosphine represented by formulae are used as the auxiliary curing agents. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004203983(A) |
申请公布日期 |
2004.07.22 |
| 申请号 |
JP20020373189 |
申请日期 |
2002.12.24 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
HASHIMOTO YOICHI;HORI KIYOTAKA;KIYOUGAKU MASAYUKI |
| 分类号 |
C08G59/40;C08G59/24;H01L23/12;H01L23/29;H01L23/31;(IPC1-7):C08G59/40 |
主分类号 |
C08G59/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
