| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent crack and moisture resistance reliability at high temperatures when sealing a surface packaging type semiconductor device without substantially containing Br/Sb. SOLUTION: The resin composition for sealing consists essentially of (A) an epoxy resin having a biphenylaralkyl skeleton, (B) a phenol resin curing agent having a triphenylmethane structure, (C) a curing accelerator such as DBU (1,8-diazabicyclo[5,4,0]undecene-7), (D) silica and (E) a coupling agent such asγ-N-phenylaminopropyltrimethoxysilane without containing a bromine flame retardant and an antimony compound. A resin-sealed type semiconductor device is obtained by sealing a semiconductor chip with a cured product of the resin composition for sealing. COPYRIGHT: (C)2004,JPO&NCIPI
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