摘要 |
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments. |
申请人 |
GENERAL ELECTRIC COMPANY;CLAYDON, GLENN, SCOTT;NIELSEN, MATTHEW, CHRISTIAN;DASGUPTA, SAMHITA;FILKINS, ROBERT, JOHN;FORMAN, GLENN, ALAN |
发明人 |
CLAYDON, GLENN, SCOTT;NIELSEN, MATTHEW, CHRISTIAN;DASGUPTA, SAMHITA;FILKINS, ROBERT, JOHN;FORMAN, GLENN, ALAN |