发明名称 |
SHAPE MEASURING METHOD OF POLISHING PAD, POLISHING METHOD OF WORKPIECE AND SHAPE MEASURING DEVICE FOR POLISHING PAD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a shape measuring method of a polishing pad and a measuring device for highly accurately and highly reliably measuring a polishing pad surface shape by measuring the surface shape of the polishing pad under a condition close to a state of polishing a workpiece. <P>SOLUTION: This shape measuring method of polishing pad measures the surface shape of a polishing pad 2 stuck to a polishing surface plate 1 by using a displacement measuring means 3, and applies vertical stress by contacting the displacement measuring means 3 with the polishing pad 2, and measures the surface shape of the polishing pad while relatively moving the polishing surface plate 1 and the displacement measuring means 3 by rotating the polishing surface plate 1 and/or the displacement measuring means 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004202630(A) |
申请公布日期 |
2004.07.22 |
申请号 |
JP20020374779 |
申请日期 |
2002.12.25 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
TSUCHIYA TOSHIHIRO |
分类号 |
B24B49/10;B24B37/20;B24B37/24;B24B53/017;H01L21/304 |
主分类号 |
B24B49/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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