发明名称 SHAPE MEASURING METHOD OF POLISHING PAD, POLISHING METHOD OF WORKPIECE AND SHAPE MEASURING DEVICE FOR POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a shape measuring method of a polishing pad and a measuring device for highly accurately and highly reliably measuring a polishing pad surface shape by measuring the surface shape of the polishing pad under a condition close to a state of polishing a workpiece. <P>SOLUTION: This shape measuring method of polishing pad measures the surface shape of a polishing pad 2 stuck to a polishing surface plate 1 by using a displacement measuring means 3, and applies vertical stress by contacting the displacement measuring means 3 with the polishing pad 2, and measures the surface shape of the polishing pad while relatively moving the polishing surface plate 1 and the displacement measuring means 3 by rotating the polishing surface plate 1 and/or the displacement measuring means 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004202630(A) 申请公布日期 2004.07.22
申请号 JP20020374779 申请日期 2002.12.25
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 TSUCHIYA TOSHIHIRO
分类号 B24B49/10;B24B37/20;B24B37/24;B24B53/017;H01L21/304 主分类号 B24B49/10
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