发明名称 CONTACT COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a contact component for forming conductive connection comprising a conductor device 2 having injection-molded thereto at least one first plastic component 3 and second plastic components 4, 5, 6 distinct from the first plastic component 3, which ensures reliable contact connection and sufficient tolerance compensation, has a simple structure, and can be produced at a low cost, and to provide a method for producing a complete contact component. SOLUTION: The above problem is solved by flexibly bending the conductor device 2 and engaging the first plastic component 3 with the second plastic components 4, 5, 6. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207238(A) 申请公布日期 2004.07.22
申请号 JP20030423207 申请日期 2003.12.19
申请人 SIEMENS AG 发明人 FISCHER GEORG;HOLZER HARALD;REKOFSKY ANDREAS;SMIRRA KARL
分类号 H01R31/06;H01R11/05;H01R13/405;H01R13/504;H01R13/506;H01R43/24;H05K5/06;(IPC1-7):H01R31/06 主分类号 H01R31/06
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