| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board wherein a space between two conductive layers is neither insufficiently nor overly filled with an insulation resin layer. SOLUTION: The multilayer printed circuit board comprises the first conductive layer 1 formed with a circuit, the second conductive layer 2 which is located opposite to the first conductive layer and has bumps formed on a face opposite to the first conductive layer, and the insulation resin layer located between the first and second conductive layers. The first and second conductive layers are interconnected through the insulation resin layer to constitute the multilayer printed circuit board so as to satisfy Tp≥(T1-Td)+T2, where Tp is a thickness of the insulation region layer, T1 is a height of the bumps, Td is a height of the bumps reduced by the deformation of the bumps when they are bonded to the circuit, and T2 is a height of the circuit. COPYRIGHT: (C)2004,JPO&NCIPI |
