Applying paste material to electronic components, involves positioning component relative to material ejection unit, and controlling unit so paste material in nozzle is ejected and transferred to component

摘要

The method involves positioning an electronic component (100) in a defined spatial position relative to a material ejection unit (120) and controlling the material ejection unit so that paste material in at least one nozzle of the material ejection unit is ejected from an output opening of the nozzle and transferred to the component. The paste material can be ejected from a number of nozzles. Independent claims are also included for the following: (a) an arrangement for applying paste material to electronic components (b) and component mounting device.