发明名称 Fluid ejection device and method of manufacturing a fluid ejection device
摘要 A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.
申请公布号 US6764165(B2) 申请公布日期 2004.07.20
申请号 US20020262406 申请日期 2002.09.30
申请人 HEWLETT PACKARD DEVELOPMENT CO 发明人 ASCHOFF CHRISTOPHER C;BOUCHER WILLIAM R;REBOA PAUL F;SMITH GILBERT G;ALTENDORF JOHN M
分类号 B41J2/14;B41J2/16;(IPC1-7):B41J2/14 主分类号 B41J2/14
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