| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide resin sealing/forming method/device of an electronic component for efficiently solving problems when a substrate mounting a plurality of semiconductor chips is formed by using a resin sealing/forming mold and for improving productivity of a product. <P>SOLUTION: An upper die 1 where an electronic component (semiconductor chip 7)-side of a substrate 6 is turned downward and is fixed and both molds 2 and 3 are completely clamped in a state where an intermediate plate 3 and a female mold 2 are clamped, a releasing film 4 is sandwiched with both molds 2 and 3, a cavity space part 29 is formed, the upper die 1 and both molds 2 and 3 are intermediately clamped, and an inner part of the cavity space 29 is vacuumed in an air interruption state. The chips 7 and a wire 8 are immersed in molten resin 31 in the cavity space part 29 and resin is sealed and formed. A resin amount adjusting means 33 formed in the cavity space part 29 adjusts a resin amount in the cavity part 29 at the time of sealing and forming resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
