发明名称 RADIATOR AND ITS PRODUCING PROCESS, SUBSTRATE FOR POWER MODULE, AND POWER MODULE
摘要 PROBLEM TO BE SOLVED: To reduce the weight while enhancing machinability and to attain a sufficient strength while preventing warp. SOLUTION: The radiator 16 is formed by impregnating a low density molding 17 formed of a material having characteristics of low thermal expansion coefficient with a metal high heat conduction material 18. The low thermal expansion material composing the low density molding 17 is an iron-nickel based alloy, e.g. Invar alloy. The high heat conduction material 18 is formed of a material having a high thermal conductivity, e.g. Cu or its alloy, or Al or its alloy. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200566(A) 申请公布日期 2004.07.15
申请号 JP20020369846 申请日期 2002.12.20
申请人 MITSUBISHI MATERIALS CORP 发明人 NAGASE TOSHIYUKI;NEGISHI TAKESHI;NAGATOMO YOSHIYUKI
分类号 H01L23/36;H01L23/373;(IPC1-7):H01L23/36 主分类号 H01L23/36
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