| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a preform material 8 from spreading to a lead terminal side, without magnifying an island part, in a lead frame 1 provided with the island part 5 which die-bonds a semiconductor chip 9 on the upper surface, by using the preform material 8, and a lead terminal 4 prolonged in one piece from the island part 5. <P>SOLUTION: Ridges 7, 7' are disposed integrally at a root part to the island part among the upper surface of the lead terminal 4, which extends integrally from the island part 5. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
