| 摘要 |
<P>PROBLEM TO BE SOLVED: To polish a surface, to smoothly rotate a work, and to uniformly polish the surface of the work by adjusting a press applied to the surface of the work. <P>SOLUTION: In this polishing head 10 of a polishing device, the work 2 installed in a work holding part 6 is contacted with a polishing plate 42 for forming a polishing surface 46 for polishing the surface of the work 2, rotation is transmitted to a rotary shaft 20 by a driving means for rotating a flange part 8 incorporated with the work holding part 6; a plurality of pressurizing chambers 12 and 14 are formed for mutually applying inverse pressure between the work holding part 6 and the flange part 8 by sending out fluid to a plurality of pipes 22 and 24 arranged inside the rotary shaft 20, and an offset small press is applied to the work 2 installed in the work holding part 6 and contacting with the polishing surface 46. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
