发明名称 |
THIN FILM PRODUCTION SYSTEM, AND CLEANING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To suppress heat generation caused by the reaction between residual gas and cleaning gas as far as possible, and to remove the residual gas in a cleaning method for a thin film production system. SOLUTION: The thin film production system is constituted in such a manner that a silicon-containing film is deposited on a substrate using silicon-containing process gas from a first gas feed part in a reaction chamber. The cleaning method for a thin film is provided with: a step where the first gas feed part feeds the silicon-containing process gas; a step where an exhaust pump exhausts the silicon-containing process gas through an exhaust tube from the reaction chamber; and a step where a second gas feed part feeds reaction gas reacted with the silicon-containing process gas after the feed of the silicon-containing process gas is stopped. The amount of the second halogen-containing gas to be fed is controlled in such a manner that its reaction with the silicon-containing process gas remaining in the reaction chamber after the stop of the feed of the first silicon-containing process gas is completed taking a prescribed time. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004197129(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020364529 |
申请日期 |
2002.12.17 |
申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
TAKANO AKIMI;TAGASHIRA KENJI |
分类号 |
C23C16/44;C23C16/24;H01L21/205;(IPC1-7):C23C16/44 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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地址 |
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