| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection precision of an electrode bonding bump, secondary mounting/bonding quality, and reliability when a semiconductor device is surface mounted. SOLUTION: Dummy balls or dummy bumps 8 are provided on the rear surface of an interposer substrate 1 and arranged on the outermost circumference thereof. Solder balls or bumps 6 are arranged on the inside of the dummy balls or dummy bumps 8. Structure/arrangement of the dummy balls or bumps are not limited to the above. COPYRIGHT: (C)2004,JPO&NCIPI
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