| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that is superior in connection reliability, without discontinuity between a wiring conductor and a wiring conductor layer, even if long-term thermal history is repeatedly applied over a long time. SOLUTION: The wiring board is formed, by stacking alternately an insulation layer 1 that a heat resistance fiber substrate is impregnated with a thermosetting resin and a wiring conductor 2 and further stacking alternately an insulating resin layer 6 and a wiring conductor layer 7 on a core substrate 5 that is formed by electrically connecting the wiring conductors 2 located vertically with the insulation layer in-between, through a through-conductor 4 with a through-hole 3 formed in the insulation layer 1 is filled with a conductor material. The through-hole 3 that is formed in the insulation layer 1 on the outermost side of the core substrate 5 is made smaller in diameter from its internal side toward its surface side. COPYRIGHT: (C)2004,JPO&NCIPI |
