发明名称 MULTI-PIECE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which is excellent in the mechanical strength and reliability of a ceramic motherboard without no cracking at the tip end of a division groove. SOLUTION: In the multi-piece wiring board, division grooves 2 having a depth corresponding to 10-30% of the thickness of the ceramic motherboard 1 and having an opening angle d of 30-60°are made in at least one of upper and lower surfaces of the ceramic motherboard 1 having rectangular wiring board regions 4 arranged vertically and horizontally, along boundaries of the board regions 4. Even when the ceramic motherboard 1 is thin, the grooves 2 having such a depth that the ceramic motherboard 1 can be separated easily and positively into the individual board regions 4 can be made. Further, the ceramic motherboard 1 can be effectively avoided from undesirably being cracked or broken. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200615(A) 申请公布日期 2004.07.15
申请号 JP20020370847 申请日期 2002.12.20
申请人 KYOCERA CORP 发明人 KUBO SHUYA
分类号 H05K1/02;H01L23/12;H03H9/25;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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