POLYIMIDE PRECURSOR COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a polyimide precursor composition which is excellent in adhesive strength against a foil of copper or other metals without decreasing the mechanical strength and useful in the field of electronics materials. SOLUTION: The polyimide precursor composition comprises (a) a polyamide containing a phenolic hydroxy group, (b) a polyimide precursor and (c) a solvent. COPYRIGHT: (C)2004,JPO&NCIPI