| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a conventional wiring board that the amount of deformation of a ceramic green sheet attendant upon the ingress of a blade becomes very large and the occurrence of cracks, etc. becomes remarkable, in the case of deepening division grooves when forming division grooves in a thick ceramic mother board. SOLUTION: In a wiring board containing many pieces, which is provided with division grooves 2, along the boundaries of wiring board regions 4, at the main face of a ceramic mother board 1 where wiring board regions 4 are arranged and made lengthwise and crosswise, the division groove 2 is made such that the side 2a of the wiring board region 4 is deeper than the intersecting part 2b at the corner. It can be broken off easily and surely separately for each wiring board region 4 without especially enlarging the amount of deformation of a ceramic green sheet at the intersecting part 2b when the blade 3 is pressed and entered, whereby it can prevent such nonconformity that stress concentrates on the intersecting part 2b at the corner of the wiring board region 4, thereby causing cracks, or the occurrence of cracks, split, etc. in the ceramic mother board 1 after baking. COPYRIGHT: (C)2004,JPO&NCIPI
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