发明名称 Semiconductor laser device and method for fabricating thereof
摘要 A semiconductor laser device having on a compound semiconductor substrate at least a lower cladding layer, an active layer, an upper cladding layer and a contact layer is provided. An upper part of the upper cladding layer and the contact layer are formed as a mesa-structured portion having a ridge stripe pattern, and the both sides of the mesa structured portion are buried with a current blocking layer. The laser device comprises the current blocking layer having a pit-like recess penetrating thereof and extending towards the compound semiconductor substrate, and a portion of the recess other than that penetrating the current blocking layer being covered or buried with an insulating film or a compound semiconductor layer with a high resistivity. The compound semiconductor substrate and the electrode layer thus can be kept insulated in an area other than a current injection area, thereby non-emissive failure due to short-circuit is prevented.
申请公布号 US2004137654(A1) 申请公布日期 2004.07.15
申请号 US20030665657 申请日期 2003.09.18
申请人 SONY CORPORATION 发明人 HOSHI NOZOMU;NAGASAKI HIROKI
分类号 H01S5/00;H01S5/22;H01S5/223;H01S5/227;(IPC1-7):G06F17/60;H01L21/00;H01L21/311 主分类号 H01S5/00
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