METHOD AND DEVICE FOR PRE-TREATING SURFACES OF SUBSTRATES TO BE BONDED

摘要

The invention relates to a method and a device for treating surfaces or bonding surfaces of substrates before bonding said substrates. According to the invention, the surfaces of substrates to be bonded are treated with an atmospheric plasma before the bonding process. In this way, the surfaces of the substrates can be cleaned, chemically activated or stripped. A layer can also be created, however, by corresponding reactive plasma gases. The advantages of the invention lie in a simple and cost-effective production of bonded substrates, whereby a high level of adhesion can be obtained.