发明名称 LED ILLUMINATION SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide an illumination system composed of an LED light-emitting body and a socket for appropriately radiating heat from LED chips. <P>SOLUTION: A heat transfer layer 12 made of diamond is formed on a substrate 11, and conductive layers 13 with prescribed patterns are formed on the transfer layer 12. The LED chips 16 are mounted on prescribed positions on the conductive layers 13. Terminals of the conductive layers 13 and electrodes of the LED chips 16 are connected. A connector part 14 to be connected to a socket is provided at an end portion of the substrate 11. The transfer layer 12 on the connector part 14 is thermally contacted with the transfer layer 12 provided on an inner surface of the opening portion of the socket. A current is supplied from the socket to each of the LED chips 16 via the conductive layers 13, and each of the LED 16 emits light. The heat generated from the LED chips 16 are radiated outward of the illumination system from the socket through the conductive layers 13, the transfer layer 12 and the connector part 14. Thereby, temperature rise of the LED chips 16 can be prevented, so that the illumination system for obtaining a large amount of light can be structured. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004199896(A) 申请公布日期 2004.07.15
申请号 JP20020363893 申请日期 2002.12.16
申请人 SHIMADA JUNICHI;KAWAKAMI YOICHI 发明人 SHIMADA JUNICHI;KAWAKAMI YOICHI;FUJITA SHIGEO
分类号 F21V29/00;F21S2/00;F21S8/04;F21V7/20;F21Y101/02;H01L25/075;H01L33/48;H01L33/60;H01L33/64;H01R13/533 主分类号 F21V29/00
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