发明名称 METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a practical method for forming a resist pattern by a PCM (portable comfortable mask) method which can be carried out with electron beams and which uses a specified material as an upper layer material having a high absorption wavelength range to be able to give a mask at the time of exposure of a lower layer and hardly producing a mixing region with the lower layer film. <P>SOLUTION: The method includes processes of: forming a lower layer photosensitive material film on a substrate; forming an upper layer photosensitive material film containing a substituted or unsubstituted benzene ring or polycyclic condensed aromatic ring or alicyclic skeleton on the lower layer photosensitive material film; exposing a specified region of the upper layer photosensitive material film to electron beams; dissolving and removing the exposed part or the unexposed part of the upper layer photosensitive material film after exposure with an alkali aqueous solution to develop; and irradiating the entire region with the light of 190 to 260 nm wavelengths while using the upper layer photosensitive material film pattern obtained by the above developing process as a mask, and developing to selectively dissolve and remove the exposed part to transfer the pattern of the upper layer photosensitive material film to the lower layer photosensitive material film. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004199084(A) 申请公布日期 2004.07.15
申请号 JP20040036944 申请日期 2004.02.13
申请人 TOSHIBA CORP 发明人 OKINO TAKASHI;ASAKAWA KOUJI;SHINODA NAOMI;GOKOCHI TORU;NAKASE MAKOTO
分类号 G03F7/039;G03F7/20;G03F7/26;H01L21/027 主分类号 G03F7/039
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