发明名称 |
METHOD FOR FORMING RESIST PATTERN |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a practical method for forming a resist pattern by a PCM (portable comfortable mask) method which can be carried out with electron beams and which uses a specified material as an upper layer material having a high absorption wavelength range to be able to give a mask at the time of exposure of a lower layer and hardly producing a mixing region with the lower layer film. <P>SOLUTION: The method includes processes of: forming a lower layer photosensitive material film on a substrate; forming an upper layer photosensitive material film containing a substituted or unsubstituted benzene ring or polycyclic condensed aromatic ring or alicyclic skeleton on the lower layer photosensitive material film; exposing a specified region of the upper layer photosensitive material film to electron beams; dissolving and removing the exposed part or the unexposed part of the upper layer photosensitive material film after exposure with an alkali aqueous solution to develop; and irradiating the entire region with the light of 190 to 260 nm wavelengths while using the upper layer photosensitive material film pattern obtained by the above developing process as a mask, and developing to selectively dissolve and remove the exposed part to transfer the pattern of the upper layer photosensitive material film to the lower layer photosensitive material film. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004199084(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20040036944 |
申请日期 |
2004.02.13 |
申请人 |
TOSHIBA CORP |
发明人 |
OKINO TAKASHI;ASAKAWA KOUJI;SHINODA NAOMI;GOKOCHI TORU;NAKASE MAKOTO |
分类号 |
G03F7/039;G03F7/20;G03F7/26;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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