WAFER-FLATNESS EVALUATION METHOD AND DEVICE FOR IMPLEMENTING THE EVALUATION METHOD; WAFER PRODUCTION METHOD USING THE EVALUATION METHOD, WAFER-QUALITY ENSURING METHOD USING THE EVALUATION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD USING THE EVALUATION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD USING THE WAFER EVALUATED BY THE EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer-flatness evaluation method whereby the flatnesses present in the surface of a wafer can be evaluated in the state closer to a flatnesses which an exposure device can sense. SOLUTION: The wafer-flatness evaluation method has a process (300) for measuring the front and rear surface shapes of a wafer, a process (301) for partitioning the front and rear surfaces of the wafer into their sites, processes (302, 303, 304, 305) for selecting wafer-flatness calculating ways in response to the positions of the valuing sites, and a process (306) for acquiring the flatnesses present in the surface of the wafer. COPYRIGHT: (C)2004,JPO&NCIPI