发明名称 Semiconductor pressure sensor has its sensor element mounted so that it faces towards a sensor mounting circuit board, thus prevent light acting on the sensor element
摘要 Pressure sensor arrangement has a housing (10) with an open side (11) in its surface and a sensor element (20) mounted in the open side for measurement of an external pressure outside the housing. The housing is attached to an attachment part (30) in the form of a circuit board. The housing is attached to the circuit board such that the pressure sensor is opposite to it. The invention also relates to a corresponding method of manufacture for a pressure sensor assembly.
申请公布号 DE10360972(A1) 申请公布日期 2004.07.15
申请号 DE20031060972 申请日期 2003.12.23
申请人 DENSO CORP., KARIYA 发明人 NOMURA, TAKASHI;HORIBA, KEIJI;FUJII, TETSUO
分类号 G01L9/00;H01L29/84;(IPC1-7):G01L19/14 主分类号 G01L9/00
代理机构 代理人
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