| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a camera module for a portable device into a chip size, and to reduce production cost. <P>SOLUTION: CCDs being photoelectric conversion elements are formed on the surface of an image sensor chip 60, and an IR filter 90 is bonded with an adhesive so as to cover the surface of the chip 60. This IR filter 90 is provided with a filtering function in addition to a chip supporting function. This IR filter 90 can be obtained and can realize both filtering function and chip supporting function by performing vacuum deposition of metal on a glass material or mixing copper particles into a glass material. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
