发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which is improved in the uniformity of plasma treatment. SOLUTION: The plasma treatment apparatus uses a method wherein electromagnetic waves are radiated and discharged in magnetic fields, and it comprises a plasma treatment chamber 1, means for supplying treatment gas to the plasma treatment chamber, evacuation means for decompressing the plasma treatment chamber, electrode 3 to place a workpiece 6 such as a wafer, electromagnetic wave radiation power supplies 4A and 4B, electromagnetic radiation antenna 2, a plurality of magnetic coils 9A and 9B which form nearly vertical magnetic fields in the treatment chamber, and yokes 10A and 10B. The yokes 10A and 10B are installed separately in the respective magnetic coils 9A and 9B. Furthermore, a non-magnetic material 11 is placed between the yokes to independently control a local distribution of magnetic fields. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200429(A) 申请公布日期 2004.07.15
申请号 JP20020367527 申请日期 2002.12.19
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 KOBAYASHI HIROYUKI;MAEDA KENJI;ARAI MASATSUGU;KAZUMI HIDEYUKI;YOSHIDA TAKESHI
分类号 C23C16/44;H01L21/3065;(IPC1-7):H01L21/306 主分类号 C23C16/44
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