| 摘要 |
An image pick-up module of the present invention is such that, on one surface of the substrate 2, a positioning reference surface P constituted of an equally flattened surface is defined, the positioning reference surface P includes a semiconductor chip positioning surface portion, a frame member mounting surface portion at which a frame member 10 is joined and mounted, and a mirror frame positioning reference surface portion at which a mirror frame position 21 is joined upon being mounted and positioned, in which the semiconductor chip 1 and lens frame member are positioned on the positioning reference surface constituted of the equally flattened surface defined on the one surface of the substrate while using the reference surface portion at which at the semiconductor chip 1 is joined and positioned and reference surface portion at which the lens frame member is joined and positioned.
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