发明名称 |
Apparatus and method for electrochemical metal deposition |
摘要 |
In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative of the current flow in each contact portion may be determined. Moreover, for precise control of the currents, means are provided for monitoring the currents.
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申请公布号 |
US6761812(B2) |
申请公布日期 |
2004.07.13 |
申请号 |
US20020303276 |
申请日期 |
2002.11.25 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
PREUSSE AXEL;MARXSEN GERD |
分类号 |
C25D7/12;C25D21/12;(IPC1-7):C25D21/12;C25D5/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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