发明名称 Breaking system and method
摘要 <p>A substrate is held on a table 22, and the substrate is caused to project beyond a lateral side of the table 22 and is positioned by a positioning section 30. Then, that part of the substrate 23 which is located on the table is locked in place by a clamping section 40. Subsequently the substrate is broken along a scribing line, with its projecting part kept pressed from above, by using a breaking unit 50. In this way, a substrate of even smaller size can be precisely broken with ease under uniform application of pressure.</p>
申请公布号 EP2255939(A2) 申请公布日期 2010.12.01
申请号 EP20100164119 申请日期 2010.05.27
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 MAEKAWA, KAZUYA;ICHIKAWA, KATSUNORI
分类号 B28D1/22;B28D7/04 主分类号 B28D1/22
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