| 摘要 |
At least two intermetallic compounds are distributed in a beta- tin matrix, one compound containing copper and tin, the other containing cobalt and tin. - A lead-free, electrically conductive solder alloy with a ternary eutectic composition comprises ca. 98.95 wt.% tin, ca. 0.37 wt.% cobalt and 0.68 wt.% copper. The eutectic melting point is ca. 224.4 deg. C. The alloy contains at least two intermetallic compounds distributed in a beta-tin matrix, one compound containing copper and tin, whilst the other contains cobalt and tin. |
