| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of producing a sputtering target by which a resist layer capable of corresponding to the requirement for increasing the recording capacity of various devices can be formed with high precision in such a manner that the oxidizing degree of metal unsaturated oxide composing the resist layer can easily be stabilized, and to provide a sputtering target. <P>SOLUTION: At least one kind of metal powder and at least one kind of metal oxide powder are mixed, or a plurality of metal oxide powders different in valences are mixed, and the mixture is subjected to pressure sintering to obtain the sputtering target. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
