| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high quality semiconductor device at a low cost. <P>SOLUTION: In a semiconductor device (1), a microelectromechanical system package, and a method for manufacturing the same, a high performance via for vertical IC packing is used. A semiconductor die (2) of a device/package has a substrate (3), and an integrated circuit (4) is formed on the front of the semiconductor dice (2). A metal bonding pad (5) is positioned on the front of the substrate and is electrically connected to the integrated circuit. A solder protrusion (12) is positioned on the metal bonding pad. A conductive via (10) passes through the substrate from the metal bonding pad and extends to the back of the substrate. Then, the side wall of a via hole is formed on the back. A plurality of substrates are overlaid on one another, and the solder protrusion on one of the substrates has an outer end fit into the via hole of the adjacent substrate. During reflow soldering, the surface tension of the melting solder protrusion automatically aligns the substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
