| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the welding step of a protection cap after dicing in a semiconductor device that is provided with a semiconductor wafer having an exposed structure part wherein a movable part is exposed and a removable protection cap that is provided in the semiconductor wafer covering the exposed structure part. <P>SOLUTION: The semiconductor device 200 is provided with a semiconductor wafer 1 having a sensing part 3 as a exposed structure part wherein a movable part is exposed and a first adhesive sheet 2 as a removable protection cap that is provided on the surface of the semiconductor wafer 1 covering the sensing part 3. While a cooling water is sprayed over the surface of the semiconductor wafer 1, a laser beam is applied thereto to dice the semiconductor wafer 1. The first adhesive sheet 2 is made of mesh-like polyimide-based resin or the like that is difficult to absorb a laser light than the semiconductor wafer 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004193399(A) |
申请公布日期 |
2004.07.08 |
| 申请号 |
JP20020360598 |
申请日期 |
2002.12.12 |
| 申请人 |
DENSO CORP |
发明人 |
YOSHIHARA SHINJI;SUZUKI YASUTOSHI |
| 分类号 |
G01P15/125;B23K26/14;B23K26/40;G01L7/10;H01L21/301;H01L21/68;H01L21/78;H01L23/58;H01L29/84;(IPC1-7):H01L21/301 |
主分类号 |
G01P15/125 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
