SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve reliability and productivity of a product. SOLUTION: The manufacturing method of a semiconductor device comprises (a) connection of a first board 10 and a second board 20 arranged so that it is overlapped with the first board 10, and (b)cutting of the first board 10 and the second board 20 by a cutting tool 120 in the same process. The cutting tool 120 has a plurality of cutters 122 and 124 which are adjacently arranged and whose cutting widths differ. The cutting tool 120 cuts the first and second substrates 10 and 20 in the different widths in the (b) process. COPYRIGHT: (C)2004,JPO&NCIPI