| 摘要 |
PROBLEM TO BE SOLVED: To mitigate the sudden change of impedance in a connection part of an external lead terminal and a metallized wiring layer and enhance the transmission characteristics of high frequency signals. SOLUTION: A package for housing a semiconductor element comprises: a base 1 having a mounting part 1a of a semiconductor element 10; a frame 3 formed with a fitting part 3a of an I/O terminal 4 in its side; the I/O terminal 4 which is constituted of a flat plate which is formed from one side of its upper surface to an opposed another side, and is composed of a dielectric having a plurality of metallized wiring layers 4a, and an erected wall composed of a dielectric joined to the upper surface of the flat plate, and is fitted to the fitting part 3a; and an external lead terminal 7 of which one end is soldered to an outside region of the frame 3 of the metallized wiring layers 4a. The external lead terminal 7 is formed, at one end thereof, with a wide part 7a having a sloped upper surface of which a width becomes gradually wider toward a tip thereof and becomes gradually thin toward the tip thereof. COPYRIGHT: (C)2004,JPO&NCIPI
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