| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module where cooling performance is high and a failure ratio in manufacturing is low. SOLUTION: The thermoelectric module is obtained by arraying a plurality of thermoelectric elements 5 on wiring conductors 3 and 4 provided on the surface of supporting substrates 1 and 2, and bonding the plurality of the thermoelectric elements 5 with the wiring conductors 3 and 4 through a soldering layer 6. In the vicinity of the bonding end 8 of the thermoelectric elements 5, a repelling layer 9 of low wetting ability to soldering which constitutes the soldering layer 6 is provided so as to surround the side faces of the thermoelectric elements 5. It is preferable that the repelling layer 9 consists of an oxide layer. COPYRIGHT: (C)2004,JPO&NCIPI |
