| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a built-up substrate stabilizing the high-frequency performances by increasing the GND (ground) via holes, and reinforcing the GND (ground) for high frequencies without influencing the part mounting. <P>SOLUTION: The built-up substrate comprises a multilayer substrate having first to fourth layer substrates 2 to 9. The first layer substrate 2 is provided on a surface thereof with a conductive pattern 3, enlarged patterns 3a, 3b each of which is an enlargement of the conductive pattern 3, a resist 4, a land pattern 5, and via holes 6. The enlarged patterns 3a, 3b are enlarged as much as possible so as to be in series with the conductive pattern 3. A number of GND (ground) via holes 6 are arranged in the enlarged patterns 3a, 3b so as to pass through the second to fourth layer substrates 7 to 9 and to be connected to a conductive pattern 10 of any size provided on the surface (releasing surface) of the fourth layer substrate 9. Thus, the GND (ground) formed by the land pattern 5 is reinforced. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
