| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesion evaluation method capable of evaluating adhesion between optional layers of a sample having a structure formed by piling a plurality of layers having minute thickness. SOLUTION: First of all, the sample having the structure formed by piling the plurality of layers is processed. For example, the sample 10 is processed into a rectangular parallelepiped having the plurality of layers exposed on the side faces. Evaluation layers 100a, 100b-100e on protrusions may be formed by notching layers 10a, 10b-10e which are evaluation objects among the plurality of layers and by scraping a peripheral part of each evaluation object. Then, the sample 10 is set up on the stage on a piezo element three-dimensional scanner 4 of a scanning probe microscope in the direction wherein the plurality of layers are aligned laterally. Then, a load is applied to a layer which is the evaluation object, for example, a projecting part 100a of the first layer 10a, by a chip 2, and displacement of the sample 100 is measured. COPYRIGHT: (C)2004,JPO&NCIPI
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