发明名称 |
PACCHETTO A CHIP MULTIPLI A SEMICONDUTTORE E PROCEDIMENTO DI FABBRICAZIONE |
摘要 |
A multi-chip package comprises a package substrate having bond fingers disposed thereon. A first chip have center bonding pads formed on a substantially center portion thereof. The first chip is disposed on the package substrate. Insulating support structures are formed on the first chip located outward of the bonding pads. A bonding wire is connected between one of the bond fingers and at least one of the center bonding pads. A second chip has is disposed over the bonding wire and overlying the insulating support structures. |
申请公布号 |
ITMI20040691(A1) |
申请公布日期 |
2004.07.07 |
申请号 |
IT2004MI00691 |
申请日期 |
2004.04.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM DONG-KUK;LEE CHANG-CHEOL |
分类号 |
H01L21/60;H01L21/98;H01L25/065 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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