| 摘要 |
PURPOSE: A TBGA(Thermal enhanced Ball Grid Array) package is provided to radiate the heat generated from a semiconductor chip by installing a heat spreader between a substrate and the semiconductor chip. CONSTITUTION: A TBGA includes a semiconductor chip, a substrate, a heat spreader, a bonding wire, a sealant, and a conductive ball. The semiconductor chip(110) includes a plurality of bonding pads. A circuit pattern(112) and a ball land(113) are adhered on both sides of the substrate, respectively. The heat spreader(130) is inserted between the substrate and the semiconductor chip. The bonding wire(115) is used for connecting the bonding pad to the circuit pattern. The sealant is formed on the substrate to cover the semiconductor chip and the bonding wire. The conductive ball(118) is adhered on the ball land.
|
