发明名称 TRENCH ISOLATION METHOD OF SEMICONDUCTOR PROCESSING
摘要 PURPOSE: A trench isolation method is provided to improve gap-fill property of an HDP(High Density Plasma) oxide layer by rounding the top corner portion of a trench. CONSTITUTION: A pad oxide layer(12) and a pad nitride layer(14) are formed on a substrate(10). A trench is formed by etching the substrate. A nitride spacer(18) is formed at the inner wall of the trench. At this time, the pad nitride layer is partially etched. Then, an HDP oxide layer(20) is filled in the trench and polished to expose the pad nitride layer.
申请公布号 KR20040061835(A) 申请公布日期 2004.07.07
申请号 KR20020088135 申请日期 2002.12.31
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HWANG, CHANG YEON
分类号 H01L21/76;(IPC1-7):H01L21/76 主分类号 H01L21/76
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