发明名称 METHOD FOR FABRICATING CAPACITOR OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for fabricating a capacitor of a semiconductor device is provided to lower the boosting frequency and the power consumption by increasing a capacitance value per unit area. CONSTITUTION: A bottom electrode(120) of a capacitor is formed on an upper surface of a semiconductor substrate(110). The first dielectric layer(132) is formed by depositing an aluminum oxide on an upper surface of the bottom electrode of the capacitor. The second dielectric layer(134) is formed on an upper surface of the first dielectric layer. The third dielectric layer(136) is formed on an upper surface of the second dielectric layer. A top electrode(140) of the capacitor is formed on an upper surface of the third dielectric layer.
申请公布号 KR20040060443(A) 申请公布日期 2004.07.06
申请号 KR20020087241 申请日期 2002.12.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, YONG GUK;KWON, DAE JIN;WON, SEOK JUN;YOON, MYEONG GEUN
分类号 H01L21/8242;G11C29/00;H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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