SEMICONDUCTOR PACKAGE STRUCTURE OF HEAT SPREADING TYPE

摘要

PURPOSE: A semiconductor package structure of heat spreading type is provided to maximize the utilization of a package space and heat-spreading efficiency by connecting an upper/lower chip with a heat spreader using a disk spring. CONSTITUTION: The first chip(11) is connected with an upper PCB(Printed Circuit Board)(10) by using gold-bumping. The second chip(12) is connected with a lower PCB by using gold-bumping. A heat spreader(14) for spreading the heat generated from the first and second chip to the outside is installed between the first and second chip. A plurality of disk springs(15) are used for connecting the heat spreader with the first and second chip. A gap between the first and second chip is formed by the disk springs.