Optical communication module and optical communication module product

摘要

A package contains therein a semiconductor laser element for emitting light and a semiconductor circuit element for driving the semiconductor laser element and is provided with an optical fiber supporting face and a back face. The optical fiber supporting face is provided for supporting an optical fiber for transmitting the light from the semiconductor laser element, and the back face is opposed to the optical fiber supporting face. The back face has a lead pin for feeding a positive-phase signal into the semiconductor circuit element and a lead pin for feeding a negative-phase signal into the semiconductor circuit element. The lead pins penetrate through the back face. The semiconductor circuit element receives positive-phase and complementary negative-phase signals, both including a high-frequency component of 10 GHz or higher, through the lead pins, converts these signals into a single-ended signal, and outputs the resulting signal to the semiconductor laser element.