APPARATUS AND METHOD FOR GRINDING BACKSIDE OF SEMICONDUCTOR WAFER

摘要

PURPOSE: An apparatus and method for grinding the backside of a semiconductor wafer are provided to sustain the uniformity of the backside of the wafer without damage by wet-etching using a nozzle. CONSTITUTION: A chuck(10) is used for spinning a wafer(15) at high speed. A plurality of pins(12) are formed on the chuck to fix stably the wafer. A nozzle(13) is used for spraying chemicals to the backside of the wafer. Nitrogen gas is supplied to a front side of the wafer through an inner path of the chuck, so that the front side of the wafer is protected. The chemicals are sprayed in the range of -20 to 80 mm by using a reference point of the wafer as a base.