发明名称 |
Three-dimensional soldering inspection apparatus and method |
摘要 |
A three-dimensional soldering inspection apparatus and method. The three-dimensional soldering inspection apparatus includes a lighting module provided with a plurality of light emitting devices, a photographing unit installed at a portion of the lighting module to photograph a subject placed inside the lighting module, an image processing unit to capture each frame image from an image photographed by the photographing unit, a storage unit to store data of each frame image, a control unit to extract three-dimensional features from each frame image and restore the extracted features as a three-dimensional image, and a display unit to display the three-dimensional image under the control of the control unit.
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申请公布号 |
US6758384(B2) |
申请公布日期 |
2004.07.06 |
申请号 |
US20020137388 |
申请日期 |
2002.05.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM CHANG-HYO;CHOI TAE-SUN |
分类号 |
B23K1/00;B23K31/12;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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