发明名称 Three-dimensional soldering inspection apparatus and method
摘要 A three-dimensional soldering inspection apparatus and method. The three-dimensional soldering inspection apparatus includes a lighting module provided with a plurality of light emitting devices, a photographing unit installed at a portion of the lighting module to photograph a subject placed inside the lighting module, an image processing unit to capture each frame image from an image photographed by the photographing unit, a storage unit to store data of each frame image, a control unit to extract three-dimensional features from each frame image and restore the extracted features as a three-dimensional image, and a display unit to display the three-dimensional image under the control of the control unit.
申请公布号 US6758384(B2) 申请公布日期 2004.07.06
申请号 US20020137388 申请日期 2002.05.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM CHANG-HYO;CHOI TAE-SUN
分类号 B23K1/00;B23K31/12;(IPC1-7):B23K31/02 主分类号 B23K1/00
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