发明名称 |
Array of dice for testing integrated circuits |
摘要 |
In one embodiment, a test interface for testing integrated circuits includes an array of dice. A removable electrical connection (e.g., an interposer) may be coupled between the array of dice and a wafer containing multiple dice to be tested. The removable electrical connection allows electrical signals to be transmitted between the array of dice and the wafer. The test interface may be used in conjunction with a tester.
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申请公布号 |
US6759865(B1) |
申请公布日期 |
2004.07.06 |
申请号 |
US20020209088 |
申请日期 |
2002.07.30 |
申请人 |
CYPRESS SEMICONDUCTOR CORPORATION |
发明人 |
GU QI;JIN BO |
分类号 |
G01R31/26;G01R31/28;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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