FLIP-CHIP CERAMIC PACKAGING METHOD

摘要

PURPOSE: A flip-chip ceramic packaging method is provided to minimize the electrical distance between a PCB(Printed Circuit Board) and a chip by forming a recess at the PCB and attaching the chip on the PCB through the recess using thermocompression bonding. CONSTITUTION: Gold bumps(200) are formed on a wafer. The wafer is divided into a plurality of chips by carrying out a die sawing process. A copper pattern(202) is formed on a PCB(204). The PCB has a two-step recess. The first chip(206) is attached on the lower portion of the recess through the Au bumps by carrying out thermocompression bonding. The second chip(208) is attached on the first chip by using an adhesive(210). At this time, the Au bumps of the second chip are attached on the upper portion of the recess by carrying out thermocompression bonding. The two-step recess is completely filled with an encapsulation part(212).