| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate exchange device which constitutes a front opening shipping box, in the device for conveying semiconductor substrates between the front opening shipping box and a front opening unified pod or between the front opening shipping box, the front opening unified pod, and the other treatment device. SOLUTION: This semiconductor substrate exchange device comprises at least one shipping box opening device for opening/closing the front opening shipping box, at least one unified pod opening device for opening/closing the front opening unified pod, and a semiconductor substrate conveying device for receiving/shipping the semiconductor substrates between the shipping box opening device and the unified pod opening device. COPYRIGHT: (C)2004,JPO&NCIPI
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